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This latest release includes improvements to graphic handling, an extended range of file formats for exporting, 3D model assembly enhancements, plus a major new version of the Impact Plug-in for Adobe Illustrator, which will for the first time offer a live 3D preview of artwork changes.
Matthew Hewitt, Business Development Manager at Arden Software, said: We released Impact 2019 last year, bringing with it a whole host of feature enhancements which have been very well received by designers and die-makers, so we are confident this follow-up release of our leading CAD software will help further improve the creative process for Impact users.
Impact 2019 Release 2 was due out earlier in the year, but we took the decision to postpone the public release following the Covid-19 pandemic, which saw a shift in priorities for both ourselves and our customers.
Users can also look forward to the new Bill of Materials (BOM), which is set to be released next year. This altogether new feature can accurately generate multi-page BOM reports from an Impact project, which provides a quick and easy way to define all the related items that are required to build one or more solutions. This includes 2D and 3D parts that may have been added from the new, customisable component libraries.
Sylvain Huet, the CEO of 3D Slash, adds that the opportunity to make 3D technology more accessible to a mainstream audience is key to the collaboration. Huet, a French engineer and entrepreneur who invents, produces and disseminates innovative technologies, has also completed a series of partnership deals with 3D Hubs, i.materialise, and Sculpteo recently for his 3D modeling software aimed at non-designer users.
Both companies say the fact that the technology is built on 25 years of experience in 3D planning and printing for medical applications through dedicated 3D visualization and planning software, engineering, and design services means the production of 3D printed, patient-specific guides and implants is a proven system.
SAP's supply-management software will be tasked with keeping this whole operation online. In addition, UPS and the German software firm signed a co-innovation agreement in May to work together on connected supply chain solutions. As esoteric as all of this may sound, there are real everyday benefits for businesses and consumers.
Feature Papers represent the most advanced research with significant potential for high impact in the field. FeaturePapers are submitted upon individual invitation or recommendation by the scientific editors and undergo peer reviewprior to publication.
Quantum computing is at an inflection point, where 127-qubitmachines are deployed, and 1000-qubit machines are perhaps only afew years away. These machines have the potential to fundamentallychange our concept of what is computable and demonstrate practicalapplications in areas such as quantum chemistry, optimization,and quantum simulation. Yet a significant resource gap remainsbetween practical quantum algorithms and real machines. A promisingapproach to closing this gap is to design software that is awareof the key physical properties of emerging quantum technologies.I will illustrate this approach with some of our recent work thatfocuses on techniques that break traditional abstractions andinform hardware design, including compiling programs directlyto analog control pulses, computing with ternary quantum bits,2.5D architectures for surface codes, and exploiting long-distancecommunication and tolerating atom loss in neutral-atom machines.
Fred Chong is the Seymour Goodman Professor in the Department ofComputer Science at the University of Chicago and the Chief Scientistfor Quantum Software at ColdQuanta. He is also Lead PrincipalInvestigator for the EPiQC Project (Enabling Practical-scale QuantumComputing), an NSF Expedition in Computing. Chong is a member of theNational Quantum Advisory Committee (NQIAC) which provides adviceto the President and Secretary of Energy on the National QuantumInitiative Program. In 2020, he co-founded Super.tech, a quantumsoftware company, which was acquired by ColdQuanta in 2022. Chongreceived his Ph.D. from MIT in 1996 and was a faculty member andChancellor's fellow at UC Davis from 1997-2005. He was also aProfessor of Computer Science, Director of Computer Engineering,and Director of the Greenscale Center for Energy-Efficient Computingat UCSB from 2005-2015. He is a recipient of the NSF CAREER award,the Intel Outstanding Researcher Award, and 13 best paper awards.
The combination of growth in compute capabilities and availabilityof large datasets has led to a re-birth of deep learning. Deep NeuralNetworks (DNNs) have become state-of-the-art in a variety of machinelearning tasks spanning domains across vision, speech, and machinetranslation. Deep Learning (DL) achieves high accuracy in thesetasks at the expense of 100s of ExaOps of computation. Hardwarespecialization and acceleration is a key enabler to improveoperational efficiency of DNNs, in turn requiring synergisticcross-layer design across algorithms, hardware, and software.
In this talk I will present this holistic approach adopted in thedesign of a multi-TOPs AI hardware accelerator. Key advances inthe AI algorithm/application-level exploiting approximate computingtechniques enable deriving low-precision DNNs models that maintainthe same level of accuracy. Hardware performance-aware design spaceexploration is critical during compilation to map DNNs with diversecomputational characteristics systematically and optimally whilepreserving familiar programming and user interfaces. The opportunitiesto co-optimize the algorithms, hardware, and the software providesthe roadmap to continue to deliver superior performance over thenext decade.
Our background is in the design and development of protective structures and restraint systems for the worldwide automotive industry. We are experts in the use of the RADIOSS (Altair HyperWorks) and LS-DYNA3D (LSTC) software. This industry standard software meets all the simulation needs of our customers.
PACT is the newest Science Alliance program aimed at not only continuing the growth of UT-ORNL collaborations, but also creating opportunities for significant on campus interdisciplinary research with potentially far reaching impacts.
3DS is a subsidiary of the French Dassault group that is also behind aircraft such as the Falcon family of business jets and the Rafale fighter. Dassault and Airbus are also partnering on a sixth-generation fighter to replace the French Rafale and Airbus' German Eurofighter Typhoon as well as the Spanish F-18 Hornet fleet. Rather than manufacturing, 3DS focuses on simulation and data software like that offered by its all-inclusive 3DEXPERIENCE platform.
All successful projects start with a good plan. For architects, engineering designers, CAD drafters, and builders, that plan comes in the form of working drawings produced by technically talented and well-trained individuals. If you have a desire to express your knowledge through computer-aided design software, San Jacinto College can give you the skills you need to make your way into this exciting field. This degree allows you to pursue careers that strike a satisfying balance between creativity, technical proficiency, and attention to detail. You can make yourself an indispensable asset in a variety of fields, such as architecture, manufacturing, engineering, construction, and the oil and gas industry, with a degree in Engineering Design Graphics.
Due to the growing complexity of organoids and other 3D cellular systems, more sophisticated 3D imaging and analysis techniques are needed to accurately and efficiently characterize these biological assays. Today, automated confocal imaging systems and 3D image analysis software are commonly used to help researchers streamline their workflow and obtain optimal results.
High-content analysis tools like the MetaXpress or IN Carta Image Analysis Software, tools allow for the finding and characterization of multiple objects/organoids, either in 2D format (for single plane, or maximum projection images) or in 3D when objects from the multiple planes are connected and reconstituted in 3D space by software. Organoids can be characterized for diameter, volume, shape, intensity of specific marker, or distance to other objects. 2b1af7f3a8